Conference Program

Program Overview

Working Schedule

Click to download pdf copy of proposed (not final) schedule

Keynote Speakers

Thursday morning

Sandeep Kumar Goel, TSMC
Academician & Sr. Director
Standardizing the 3D Frontier: How IEEE Std P3537/3Dblox Streamlines 2.5D/3D Advanced Packaging

 

Thursday afternoon

Sung Kyu Lim, USC
Dean’s Professor of Electrical and Computer Engineering
Logic Folding and Fine-Grained Logic-on-Logic 3D ICs: A Key Enabler of Tau Law

 

Friday morning

Rozalia Beica, Rapidus
Field CTO of Packaging Technologies
Heterogeneous Integration and Chiplet Architectures as the Next Scaling Paradigm

Friday afternoon

Muhannad S Bakir, Georgia Tech
Dan Fielder Professor, Director of 3D Systems Packaging Research Center
3D Heterogeneous Integration (3DHI): Emerging Trends and Opportunities

Invited Speakers

  • Baris Arslan, imec
    Principal DFT Methodology Researcher
    Topic: “Exploring Test Flows and Test Access Architectures for Chiplet-Based Systems”
  • Jennifer Dworak, Southern Methodist Unversity
    Professor, Electrical and Computer Engineering and Associate Dean, School of Engineering
    Topic: “Hybrid Bond Die-to-Die Interconnects: An Analysis of Defects, Cluster Effects and Repair Strategy”
  • Imene Jadli, imec
    Portfolio Manager, Optical Interconnect team
    Topic: “From 3D Integration to Optical Interconnect : Building the Interconnect Foundation for the AI Era”
  • Robert Patti, NHanced Semiconductors
    President
    Topic: “3D Photonic Integration: Enabling Multi-Terabit Operation“
  • Masayoshi Tagami, Kioxia
    Group Manager, Advanced Memory Research and Development
    Topic: “CMOS Directly Bonded to Array (CBA) Technology for Future 3D Flash Memory”
  • Andras Vass-Varnai, Siemens-EDA, USA
    3D IC Solution Architect – Thermal Management and Reliability
    Topic: “From Silicon to System: Enabling Scalable 3D IC Packaging Through Multiphysics Simulation”

Panel Discussion

“The Self-Sustaining Economics of a Truly Open Chiplet Market”

Moderator:
  • Paul Franzon, NCSU, Assoc. Dept. Head for Graduate Affairs & Cirrus Logic Distinguished Professor
Panelists: