Conference Program

The 3DIC 2026 committee is currently building its program and seeks speakers, tutorial presenters, panel organizers, and workshop leaders. Topics may include, but are not limited to, the following:

Technology: Materials, equipment, wafer handling, diverse substrates, Through Silicon  Vias (TSV), alignment, bonding (thermo-compression, electrostatic, hybrid, temporary  adhesive), de-bonding, wafer cleaning, thinning, dicing, chiplets, interposers (active,  passive), 3D integration (monolithic, heterogeneous), capacitive coupling, inductive  coupling, multilevel epitaxial growth, etc.

Applications, Design and Computer Aided Design (CAD): Synthesis, design flows, signal design, power integrity, thermal  considerations, mechanical stress, reliability, test, techniques, analysis, chiplet and chiplet design etc.  Applications to be considered may include imaging, memory, processors,  communications, networking, wireless, biomedical, sensors, SOC, MEMS, DSP, FPGA,  RF, microwave, millimeter wave, analog circuits, biomedical circuits, photonics,  optoelectronics, etc. Application areas such quantum computing, embedded systems, artificial intelligence and others.

CALL FOR PROPOSALS

Submit your ideas to the program committee

Keynote Speakers

Sandeep Kumar Goel, TSMC
Academician & Sr. Director

Sung Kyu Lim, University of Southern California
Dean’s Professor of Electrical and Computer Engineering

Rozalia Beica, Rapidus
Field CTO of Packaging Technologies

Muhannad S Bakir, Georgia Tech
Dan Fielder Professor, Director of 3D Systems Packaging Research Center

Invited Speakers

  • Baris Arslan, imec
    Principal DFT Methodology Researcher
    Topic: tbd
  • Imene Jadli, imec
    Portfolio Manager, Optical Interconnect team
    Topic: “From 3D Integration to Optical Interconnect : Building the Interconnect Foundation for the AI Era”
  • Robert Patti, NHanced Semiconductors
    President
    Topic: “3D Photonic Integration: Enabling Multi-Terabit Operation“
  • Masayoshi Tagami, Kioxia
    Group Manager, Advanced Memory Research and Development
    Topic: “CMOS Directly Bonded to Array (CBA) Technology for Future 3D Flash Memory”
  • Andras Vass-Varnai, Siemens-EDA, USA
    3D IC Solution Architect – Thermal Management and Reliability
    Topic: “From Silicon to System: Enabling Scalable 3D IC Packaging Through Multiphysics Simulation”

Panel Discussion

“The Self-Sustaining Economics of a Truly Open Chiplet Market”

Moderator:
  • Paul Franzon, NCSU, Assoc. Dept. Head for Graduate Affairs & Cirrus Logic Distinguished Professor
Panelists: