Conference Program

The 3DIC 2026 committee is currently building its program and seeks speakers, tutorial presenters, panel organizers, and workshop leaders. Topics may include, but are not limited to, the following:

Technology: Materials, equipment, wafer handling, diverse substrates, Through Silicon  Vias (TSV), alignment, bonding (thermo-compression, electrostatic, hybrid, temporary  adhesive), de-bonding, wafer cleaning, thinning, dicing, chiplets, interposers (active,  passive), 3D integration (monolithic, heterogeneous), capacitive coupling, inductive  coupling, multilevel epitaxial growth, etc.

Applications, Design and Computer Aided Design (CAD): Synthesis, design flows, signal design, power integrity, thermal  considerations, mechanical stress, reliability, test, techniques, analysis, chiplet and chiplet design etc.  Applications to be considered may include imaging, memory, processors,  communications, networking, wireless, biomedical, sensors, SOC, MEMS, DSP, FPGA,  RF, microwave, millimeter wave, analog circuits, biomedical circuits, photonics,  optoelectronics, etc. Application areas such quantum computing, embedded systems, artificial intelligence and others.

CALL FOR PROPOSALS

Submit your ideas to the program committee

Working Program:

Alphabetical List of Confirmed Speakers

  • Baris Arslan, imec
    Principal DFT Methodology Researcher
    Topic: “2.5D Test Access Architectures for Automotive Chiplets“
  • Rozalia Beica, Rapidus
    Field CTO of Packaging Technologies
    Topic: “Heterogeneous Integration / Chiplet technology — new scaling strategy at Rapidus“
  • Muhannad Bakir, Georgia Tech
    Dan Fielder Professor, Director of 3D Systems Packaging Research Center
    Topic: tbd
  • Sreejit Chakravarty, Ampere Computing
    Senior Distinguished Engineering Leader and Fellow
    Topic: “Chiplet Interconnect Test and Repair Standardization (IEEE Std P3405)“
  • Sandeep Kumar Goel, TSMC
    Academician & Sr. Director
    Topic: “Standardizing the 3D Frontier: How IEEE Std P3537/3Dblox Streamlines 2.5D/3D Advanced Packaging”
  • Imene Jadli, imec
    Portfolio Manager, Optical Interconnect team
    Topic: “3D Silicon Photonics“
  • Sung Kyu Lim, University of Southern California
    Dean’s Professor of Electrical and Computer Engineering
    Topic: “Logic Folding and Fine-Grained Logic-on-Logic 3D ICs: A Key Enabler of Tau Law“
  • Robert Patti, NHanced Semiconductors
    President
    Topic: “3D Photonic Integration: Enabling Multi-Terabit Operation“
  • Masayoshi Tagami, Kioxia
    Group Manager, Advanced Memory Research and Development
    Topic: “Multi-Stacked Cell Array Architecture with Wafer-to-Wafer Cu Direct Bonding for Ultra-High-Density 3D Flash Memory“
  • Andras Vass-Varnai, Siemens-EDA, USA
    3D IC Solution Architect – Thermal Management and Reliability
    Topic: “From Silicon to System: Enabling Scalable 3D IC Packaging Through Multiphysics Simulation”
  • Eric Vogel, Georgia Tech
    Executive Director, Hightower Professor of Materials Science and Engineering
    Topic: tbd

Panel Discussion: “The Self-Sustaining Economics of a Truly Open Chiplet Market”

  • Martin Keim, Siemens EDA, Senior Engineering Director
  • Robert Patti, NHanced Semiconductors, President
  • (additional panelists to be announced)