Welcome to 3DIC: The IEEE International 3D Systems Integration Conference 2019 Website
The IEEE International 3D Systems Integration Conference (3DIC) will be held at the Hotel Metropolitan Sendai and Miyagino Ward Cultural Center in Sendai, Japan in October 8th-10th, 2019. This conference combines the previous ASET and IEEE EDS Japan sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the Fraunhofer and IEEE CPMT sponsored International 3D System Integration Workshop held in 2003 & 2007 in Munich.
After the first combined conference in San Francisco in 2009, the 2nd IEEE International Conference on 3D System Integration was held in Munich in 2010, the 3rd conference in Osaka in 2012, the fourth conference in San Francisco in 2013, the fifth conference in Cork in 2014, the sixth conference in Sendai in 2015 and the seventh in San Francisco in 2016.
The IEEE 3DIC 2019 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and attendees to submit and interact with 3D researchers from all around world. Papers are solicited in subject topics, including, but not limited to, the following:
3D/2.5D Integration Technology: Through Si Vias (TSV), Wafer thinning, Wafer alignment, Wafer bonding, Wafer dicing, Interposer (Si/Glass), Optical Interconnection, FOWLP, Monolithic 3D integration, Heterogeneous 3D/2.5D integration
3D/2.5D IC Circuits Technology: SOC, Memory, Processor, DSP, FPGA, RF and µ-wave/mm-wave, Analog circuits, Biomedical circuits
3D/2.5D Applications: Artificial Intelligence, Machine Learning, Deep Learning, Imaging, IoT, Memory, Processors, Communications, Network-ing, Wireless, Biomedical
3D/2.5D Design and Test Methodology: CAD, Synthesis, Design flows, Signal and power integrity analysis and design in 3D/2.5D, Thermal de-sign and analysis, Test and design for test, Mechanical stress and relia-bility design and analysis