IEEE International 3D Systems Integration Conference (3DIC)
Sep. 25th – Sep. 27th 2024
Sendai, Japan

Abstracts Submission


The IEEE International 3D Systems Integration Conference (3DIC) will be held at the Hotel Metropolitan Sendai and Sendai Kokusai Hotel in Sendai, Japan in September 25-27, 2024. This conference combines the previous ASET and IEEE EDS Japan sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the Fraunhofer and IEEE CPMT sponsored International 3D System Integration Workshop held in 2003 & 2007 in Munich.
So much has changed since the first combined conference in San Francisco in 2009, 3D integrated circuits have moved from academic curiosity to solid commercial reality. The underlying technologies continually improve and evolve, incorporating new methods and resources. Today’s hot topics include chiplets, photonic interconnect, micro-die handling, and exotic substrates. This 2023 conference will focus on the research and science of 3DICs. It will cover relevant 3D/Chiplet topics from manufacturing, processes, materials, and equipment to circuit designs, design methodology, and applications.

What’s New


  • Abstract submission due
    Friday, June 14, 2024 >> Friday, June 30, 2024 (PST)  *extended
  • Paper review period
    Monday, July 1 through Monday, July 15, 2024​
  • Acceptance notification
    Monday, July 29, 2024
  • Paper submission due
    Friday, August 30, 2024

Contact: 3DIC Secretariat