3DIC 2023: The IEEE International Conference on 3D System Integration
So much has changed since the first 3DIC conference in 2010! 3D integrated circuits have moved from academic curiosity to solid commercial reality. The underlying technologies continually improve and evolve, incorporating new methods and resources. Today’s hot topics include chiplets, photonic interconnect, micro-die handling, and exotic substrates. This 2023 conference will focus on the research and science of 3DICs. It will cover relevant 2.5D/3D topics from manufacturing, processes, materials, and equipment to circuit designs, design methodology, and applications.
The call for papers is available for download here: 3DIC Call for Papers
Deadline for submission has been extended to Feb 5th 2023
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