Welcome to 3DIC 2021: The IEEE International Conference on 3D System Integration
After a one-year hiatus, 3DIC will once again unite 2.5D/3D researchers and developers from all around the world. This year’s conference employs a hybrid format of in-person events and virtual events. Talks, panels, exhibits, papers, and discussions will foster a stimulating exchange of ideas and technical information.
So much has changed since the first 3DIC conference in 2010! 3D integrated circuits have moved from academic curiosity to solid commercial reality. The underlying technologies continually improve and evolve, incorporating new methods and resources. Today’s hot topics include chiplets, photonic interconnect, micro-die handling, and exotic substrates. This conference will focus on the research and science of 3DICs. It will cover relevant 2.5D/3D topics from manufacturing, processes, materials, and equipment to circuit designs, design methodology, and applications.
Agenda and format are currently being assembled. A Call for Papers has been published. Prospective attendees, authors, and speakers are invited to subscribe to receive email updates as plans progress.