IEEE International 3D Systems Integration Conference (3DIC)
Oct 1 – 2, 2026
Georgia Institute of Technology — Atlanta, Georgia

 

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The 2026 3DIC conference will be held October 1 – 2
at the Georgia Institute of Technology in Atlanta, GA

3DIC 2026 will cover all 3D system integration topics including 3D/2.5D process technology, interposers, and chiplets, materials, equipment, circuit technology, design methodology, and applications. Attendees will interact with researchers from all around the world.

Important dates:

  • Registration: Open now
  • Vendor registration: Open now
  • Abstract submission: Closed
  • Acceptance notifications: September 14
  • Full camera-ready submissions due: September 29

Keynote Speakers

Sandeep Kumar Goel, TSMC
Academician & Sr. Director

Sung Kyu Lim, University of Southern California
Dean’s Professor of Electrical and Computer Engineering

Rozalia Beica, Rapidus
Field CTO of Packaging Technologies

Muhannad Bakir, Georgia Tech
Dan Fielder Professor, Director of 3D Systems Packaging Research Center

More information on the Program page