IEEE International 3D Systems Integration Conference (3DIC)
Sep. 25th – Sep. 27th 2024
Sendai, Japan


The IEEE International 3D Systems Integration Conference (3DIC) will be held at the Hotel Metropolitan Sendai and Sendai Kokusai Hotel in Sendai, Japan in September 25-27, 2024. This conference combines the previous ASET and IEEE EDS Japan sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the Fraunhofer and IEEE CPMT sponsored International 3D System Integration Workshop held in 2003 & 2007 in Munich.
So much has changed since the first combined conference in San Francisco in 2009, 3D integrated circuits have moved from academic curiosity to solid commercial reality. The underlying technologies continually improve and evolve, incorporating new methods and resources. Today’s hot topics include chiplets, photonic interconnect, micro-die handling, and exotic substrates. This 2023 conference will focus on the research and science of 3DICs. It will cover relevant 3D/Chiplet topics from manufacturing, processes, materials, and equipment to circuit designs, design methodology, and applications.

The IEEE 3DIC 2024 will cover all 3D system integration topics, including 3D/Chiplet process technology, materials, equipment, circuits technology, design methodology, and applications. The conference invites authors and attendees to submit and interact with researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following:

3D/Chiplet Integration Technology:
Through-Si Vias (TSV), Hybrid bonding, Wafer thinning, Wafer/Chip alignment, WtW/WtC/CtC bonding, Wafer dicing, Interposer (Si/Glass/Organic), Optical interconnect, FOWLP, Monolithic 3D integration, Heterogeneous integration, and Chiplet technology

3D/Chiplet IC Circuits Technology:
SoC, 3D NAND, HBM, CPU/GPU, DSP, FPGA, ASIC, RF and mm-wave, Analog circuits, Biomedical circuits, and Chiplet design

3D/Chiplet Applications:
Artificial Intelligence, Machine Learning, Deep Learning, Imaging, IoT, Memory, Processors, Communications, Networking, Wireless, Sensors, Biomedical

3D/Chiplet Design and Test Methodology:
CAD, Synthesis, Design flows, Signal and power integrity analysis and design in 3D/Chiplet, Thermal design and analysis, Test and design for test, Mechanical stress and reliability design and analysis

Contact: 3DIC Secretariat