3DIC 2021

IEEE International 3D System Integration Conference (3DIC)
November 15-18, 2021
Raleigh, North Carolina, USA

Closing RemarksSchedule

3DIC 2021: The IEEE International Conference on 3D System Integration

 

After a one-year hiatus, 3DIC once again united 2.5D/3D researchers and developers from all around the world.  The conference employed a hybrid format of in-person events and virtual events.  Talks, panels, exhibits, papers, and discussions fostered a stimulating exchange of ideas and technical information.

So much has changed since the first 3DIC conference in 2010!  3D integrated circuits have moved from academic curiosity to solid commercial reality.  The underlying technologies continually improve and evolve, incorporating new methods and resources.  Today’s hot topics include chiplets, photonic interconnect, micro-die handling, and exotic substrates.  This conference focused on the research and science of 3DICs.  It covered relevant 2.5D/3D topics from manufacturing, processes, materials, and equipment to circuit designs, design methodology, and applications.

For information about publications, recordings, and Best Paper awards, see the Closing Remarks.

 The schedule is available for download.

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