The IEEE International 3D Systems Integration Conference (3DIC) will be held at the Hotel Metropolitan Sendai and Sendai Kokusai Hotel, Japan on September 25-27, 2024. The deadline for abstract submission is June 30, 2024 (PST).

Abstracts are to be one page of text (500 words) and one-page figures.

Abstracts Submission

Click here for Abstracts Template

Click here for Call-for-paper

Notifications will occur by July 29, 2024 and full papers in IEEE format will be required by August 30, 2024.


Abstract submission due
Friday, June 14, 2024 >> Friday, June 30, 2024 (PST)  *extended
Paper review period
Monday, July 1 through Monday, July 15, 2024​
Acceptance notification
Monday, July 29, 2024
Paper submission due
Friday, August 30, 2024

The IEEE 3DIC 2024 will cover all 3D system integration topics, including 3D/Chiplet process technology, materials, equipment, circuits technology, design methodology, and applications. The conference invites authors and attendees to submit and interact with researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following:

3D/Chiplet Integration Technology:
Through-Si Vias (TSV), Hybrid bonding, Wafer thinning, Wafer alignment, Wafer bonding, Wafer dicing, Interposer (Si/Glass/Organic), Optical interconnect, FOWLP, Monolithic 3D integration, Heterogeneous integration, and Chiplet technology

3D/Chiplet IC Circuits Technology:
SoC, 3D NAND, HBM, CPU/GPU, DSP, FPGA, ASIC, RF and mm-wave, Analog circuits, Biomedical circuits, and Chiplet design

3D/Chiplet Applications:
Artificial Intelligence, Machine Learning, Deep Learning, Imaging, IoT, Memory, Processors, Communications, Networking, Wireless, Sensors, Biomedical

3D/Chiplet Design and Test Methodology:
CAD, Synthesis, Design flows, Signal and power integrity analysis and design in 3D/Chiplet, Thermal design and analysis, Test and design for test, Mechanical stress and reliability design and analysis