Paper Submissions

The IEEE International 3D Systems Integration Conference is a peer-reviewed conference that aims to bring together 3D researchers from academia, government, and industry. 3DIC 2026 invited high-quality novel research paper submissions that focus on 3D methodological and application perspectives.

Topic Areas

Papers were solicited on all 3D IC topics including, but not limited to, the following:

Technology: Materials, equipment, wafer handling, diverse substrates, Through Silicon  Vias (TSV), alignment, bonding (thermo-compression, electrostatic, hybrid, temporary  adhesive), de-bonding, wafer cleaning, thinning, dicing, chiplets, interposers (active,  passive), 3D integration (monolithic, heterogeneous), capacitive coupling, inductive  coupling, multilevel epitaxial growth, etc.

Applications, Design and Computer Aided Design (CAD): Synthesis, design flows, signal design, power integrity, thermal  considerations, mechanical stress, reliability, test, techniques, analysis, chiplet and chiplet design etc.  Applications to be considered may include imaging, memory, processors,  communications, networking, wireless, biomedical, sensors, SOC, MEMS, DSP, FPGA,  RF, microwave, millimeter wave, analog circuits, biomedical circuits, photonics,  optoelectronics, etc. Application areas such quantum computing, embedded systems, artificial intelligence and others.

Important Dates

• Abstract submission Closed
• Acceptance notifications: September 7
• Full camera-ready paper submissions due: September 25