Paper Submissions

The IEEE International 3D Systems Integration Conference is a peer-reviewed conference that aims to bring together 3D researchers from academia, government, and industry. 3DIC 2026 invited high-quality novel research paper submissions that focus on 3D methodological and application perspectives.

Topic Areas

Papers were solicited on all 3D IC topics including, but not limited to, the following:

Technology: Materials, equipment, wafer handling, diverse substrates, Through Silicon  Vias (TSV), alignment, bonding (thermo-compression, electrostatic, hybrid, temporary  adhesive), de-bonding, wafer cleaning, thinning, dicing, chiplets, interposers (active,  passive), 3D integration (monolithic, heterogeneous), capacitive coupling, inductive  coupling, multilevel epitaxial growth, etc.

Applications, Design and Computer Aided Design (CAD): Synthesis, design flows, signal design, power integrity, thermal  considerations, mechanical stress, reliability, test, techniques, analysis, chiplet and chiplet design etc.  Applications to be considered may include imaging, memory, processors,  communications, networking, wireless, biomedical, sensors, SOC, MEMS, DSP, FPGA,  RF, microwave, millimeter wave, analog circuits, biomedical circuits, photonics,  optoelectronics, etc. Application areas such quantum computing, embedded systems, artificial intelligence and others.

Abstract submission is closed; acceptance notifications have been made.

Full camera-ready paper submissions are due by September 30

 

Submission Instructions for Accepted Papers

  • Registration and travel planning
    At least one author must register at the full (not student) registration rate to present the paper. Non-presented papers will not be indexed or included in IEEE Xplore. If you need a support letter for a travel Visa please notify the chairs as soon as possible.
  • Update your manuscript according to the IEEE Template
    Update your paper using the official IEEE Conference Template (Word or LaTeX) in standard format (Double Column, 4 or 5 Pages).
  • Pass your paper through PDF Express to make sure it is Xplorer compliant.
    You will use your email address and create a password.
    The conference code for login is 71189X

     

New instructions for final steps —
Please upload your paper to both Georgia Tech and IEEE

  • Upload your pdf to the Georgia Tech Conference Archive
    Please upload your presentation file to:
    https://gtri.app.box.com/f/8e7c0ea31727435d9d02642e7e023246

     

    • Please name your file: sessionnumber_papernumber_lastname-of-first-author.pdf.
    • Supplemental files may also be uploaded, including zip files.
    • In person or email submission (at  3dic@gatech.edu ) will also be accepted.
  • Submit your file via the IEEE edas website
    • Search for IEEE 3DIC conference
    • Submit your Final Manuscript pdf to both the Conference and “Full papers” track
    • Note: If you have issues with margins and you used LaTeX, please use this command:
      \\documentclass[11pt, conference, letterpaper]{IEEEtran}\\addtolength{\\topmargin}{0.04in} 
  • Submit the IEEE copyright form via the IEEE edas website
    • Look for the copyright generation button
    • Sign and submit the Electronic IEEE Copyright Form (eCF)
Questions?

Email your questions to the conference committee