Hybrid Bond Die-to-Die Interconnects: An Analysis of Defects, Cluster Effects and Repair Strategy

Abstract

In a multi-die 2.5D/3D package, defective die-to-die interconnect(s) can at best affect performance or at worst render the whole package defective even though it contains many good chiplets. With defective interconnect(s), the choice is either to discard the entire package, affecting yield, or repair the interconnect when possible to mitigate the loss. This work presents an analysis of physical defects on various die-to-die interconnect types and their causes, focusing on hybrid bonds. This understanding of defects is critical for building repair strategies to address interconnect failures. We classify each defect with its corresponding fault model to characterize its effect, the required test for detection, and a suitable repair strategy. We also illustrate how defect clustering affects hybrid bonds and impacts repair schemes. With this understanding of interconnect defects and fault modeling, cost effective repair strategies can be built to improve yield.

Co-authors: Moiz Khan, Anshuman Chandra

Biography

Jennifer Dworak is a Professor (now Dean) in the Department of Electrical and Computer Engineering at Southern Methodist University and an Associate Dean for the School of Engineering. Her research interests include manufacturing test, the reliability of digital circuits and systems, and hardware security.  She is an author on multiple technical articles, including two papers that won a Best Paper Award from the VLSI Test Symposium and a paper that won a TTTC Naveena Nagi Award.  She is helping to lead the Texoma Semiconductor Tech Hub, which received official designation by the Economic Development Administration (EDA) of the U.S. Department of Congress in October of 2023.  Jennifer holds PhD, MS, and BS degrees in electrical engineering from Texas A&M University in College Station, TX.