3D Heterogeneous Integration (3DHI): Emerging Trends and Opportunities 

Abstract

In recent years, the field of advanced packaging has taken center stage as the semiconductor industry pursues ever more energy efficient, high-performance, and low-cost electronic systems. While the field of advanced packaging is undergoing revolutionary technology advances today, there is little doubt that advanced packaging in the new era of Moore’s Law will offer extreme levels of die integration/bonding and begin to blur the boundary between on- and off-chip connectivity due to ever denser physical I/O interfaces/bonds. We will first begin with a review of recent advanced packaging technologies. Next, we will present our work addressing ‘inverse-hybrid bonding technologies’ and reconstituted wafers using SiO2 and AlN. Further, this presentation will also share our efforts in glass-core substrates and 3D-stitch chips.

Biography

Muhannad S Bakir is the GlobalFoundries Termed Chair in Packaging and 3D Heterogeneous Integration Professor in the School of Electrical and Computer Engineering at Georgia Tech and the Director of the 3D Systems Packaging Research Center. His areas of interest include 2.5D and 3D heterogeneous integration technologies, photonic interconnects, and embedded cooling.

Dr. Bakir and his research group have received more than thirty papers and presentation awards. Dr. Bakir is the recipient of the 2012 DARPA Young Faculty Award, 2013 Intel Early Career Faculty Honor Award, and the 2018 IEEE Electronics Packaging Society (EPS) Exceptional Technical Achievement Award “for contributions to 2.5D and 3D IC heterogeneous integration, with focus on interconnect technologies.”