3D Photonic Integration: Enabling Multi-Terabit Operation

Abstract

This talk will discuss the increasing use of advanced packaging for photonics. New technology has improved device alignment enabling new approaches for disaggregation and chipletization.  Further, growing TFLN foundry support for photonics is enabling transceiver operations well beyond 1.6Tb/s but also demanding more of drivers, receivers and other support circuitry that must be co-located for efficiency. The talk will discuss the current capabilities and roadmap for advanced packaged photonics.

Biography

Bob Patti is the founder and President of NHanced Semiconductors, a QCi company. Bob established NHanced to further advance and develop 2.5D/3D technologies, chiplets, die and wafer stacking, and other advanced packaging. Prior to starting NHanced, Bob served as CTO of Tezzaron Semiconductor Corporation, a leading force in 3D integrated circuit (3DIC) technology that built its first working 3DIC in 2004. Tezzaron grew out of Bob’s initial startup, ASIC Designs Inc., an R&D company specializing in high-performance systems and ASICs. During his 12 years with ASIC Designs he helped design over 100 chips. Bob received the SEMI Award for North America in 2009, served as Vice-Chairman of JEDEC’s DDRIII / Future Memories Task Group, and holds 21 US patents, numerous foreign patents, and many more pending patent applications in deep sub-micron semiconductor technologies. He holds a BSEE/CS and BSPH from Rose-Hulman Institute of Technology.