Keynote Speakers
CHIPS -NAPMP: Overview and Next Steps
Dr. George Orij
Deputy Director, CHIPS NAPMP (National Advanced Packaging Manufacturing Program), NIST
Wafer-level 3D Heterogeneous Chiplet Integration Technology for AI and Quantum Computing Systems
Dr. Mitsumasa Koyanagi
Senior Research Fellow, Tohoku University
IBM NorthPole: Brain-Inspired Neural Inference Architecture Intertwining Compute with Memory
Dr. Takanori Ueda
Staff Research Scientist, IBM Research – Tokyo
AI Computing Trends for Mobile Processor Design
Dr. Bor-Sung Liang
Senior Director, MediaTeck
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