Wrap-Up

• 110 registrants
• 12 countries represented
• 23 papers presented
• 6 invited speakers
• 4 keynotes
• 1 five-member panel discussion
• 1 well-attended social event

“Best Paper” Awards

Congratulations to these authors for Best Paper Awards at IEEE 3DIC 2026!

• Chung-Kuan Cheng, Bill Lin, Susmita Sur-Kolay,  Yucheng Wang, Ying Yuan
  “Standard-Cell Logic Folding with Heterogeneous Drive-Strength Stacking and Intra-Cell Multi-Tier Routing”
• Lixue Cheng, Hansol Lee, Boya Li, Dohyun Go, Andrew Kummel, Muhannad Bakir
  “Electrical Characterization and Thermal Evaluation of AlN-Infilled Fine-Pitch Cu Pillar Interconnects”