Paper Submissions

The IEEE International 3D Systems Integration Conference is a peer-reviewed conference that aims to bring together 3D researchers from academia, government, and industry. 3DIC 2026 invited high-quality novel research paper submissions that focus on 3D methodological and application perspectives.

Topic Areas

Papers were solicited on all 3D IC topics including, but not limited to, the following:

Technology: Materials, equipment, wafer handling, diverse substrates, Through Silicon  Vias (TSV), alignment, bonding (thermo-compression, electrostatic, hybrid, temporary  adhesive), de-bonding, wafer cleaning, thinning, dicing, chiplets, interposers (active,  passive), 3D integration (monolithic, heterogeneous), capacitive coupling, inductive  coupling, multilevel epitaxial growth, etc.

Applications, Design and Computer Aided Design (CAD): Synthesis, design flows, signal design, power integrity, thermal  considerations, mechanical stress, reliability, test, techniques, analysis, chiplet and chiplet design etc.  Applications to be considered may include imaging, memory, processors,  communications, networking, wireless, biomedical, sensors, SOC, MEMS, DSP, FPGA,  RF, microwave, millimeter wave, analog circuits, biomedical circuits, photonics,  optoelectronics, etc. Application areas such quantum computing, embedded systems, artificial intelligence and others.

Abstract submission is closed; acceptance notifications have been made.

Full camera-ready paper submissions are due by September 21

Submission Instructions for Accepted Papers

• Update Your Manuscript According to the IEEE Template
  Update your paper using the official IEEE Conference Template (Word or LaTeX) in standard format (Double Column, 4 or 5 Pages).  IEEE Conference template: https://www.ieee.org/conferences/publishing/templates
• Registration and Travel Planning
  At least one author must register at the full (not student) registration rate to present the paper. Non-presented papers will not be indexed or included in IEEE Xplore. If you need a support letter for a travel Visa please notify the chairs as soon as possible.
• Prepare for later steps (we’ll share specific links for these soon):
  • IEEE Compliance — All final PDFs must be validated for IEEE compliance using PDF eXpress before final submission.
  • Submit Final Files — You will upload your final camera-ready PDF directly through your CMT author console.
  • IEEE Copyright — You will will complete the Electronic IEEE Copyright Form (eCF) online when you submit your paper.