Thank you for attending 3DIC 2024 in Sendai, Japan!
We are pleased to announce that the conference was attended by 220 participants.
We hope to see you at 3DIC 2025, scheduled at the end of September 2025, in North Carolina, USA.

IEEE 3DIC 2024: INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE

The IEEE International 3D Systems Integration Conference (3DIC) will be held at the Hotel Metropolitan Sendai and Sendai Kokusai Hotel in Sendai, Japan in September 25-27, 2024. This conference combines the previous ASET and IEEE EDS Japan sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the Fraunhofer and IEEE CPMT sponsored International 3D System Integration Workshop held in 2003 & 2007 in Munich.
So much has changed since the first combined conference in San Francisco in 2009, 3D integrated circuits have moved from academic curiosity to solid commercial reality. The underlying technologies continually improve and evolve, incorporating new methods and resources. Today’s hot topics include chiplets, photonic interconnect, micro-die handling, and exotic substrates. This 2024 conference will focus on the research and science of 3DICs. It will cover relevant 3D/Chiplet topics from manufacturing, processes, materials, and equipment to circuit designs, design methodology, and applications.

What’s New

• September 20
  Advanced Program is available.
• September 4
  The early-bird registration due date is extended to September 10, 2024 (JST).
• June 12
  The abstract submission due date is extended to June 30, 2024 (PST).
• June 4
  Abstract submission is available by June 14, 2024.

IMPORTANT DATES

• Abstract submission due
  Friday, June 14, 2024 >> Friday, June 30, 2024 (PST)  *extended
• Paper review period
  Monday, July 1 through Monday, July 15, 2024​
• Acceptance notification
  Monday, July 29, 2024
• Paper submission due
  Friday, August 30, 2024

Contact: 3DIC Secretariat
3dic_2024@semiconportal.com