Speakers And Abstracts


Click speaker’s name for further information.

The Emergence of 2.5 D and 3D Glass Packaging, Manufacturing and Products

Rao Tummala_Abstract

Founding Director and Emeritus Professor, Georgia Tech USA


Low Barrier Access to System Integration Prototyping Services through EUROPRACTICE

Romano Hoofman_Abstract

Strategic Development Director, IMEC


Photonic Systems-in-Packages based on thin glass – pSiP

Gunnar Böttger_Abstract

Senior Scientist, Fraunhofer Institute for Reliability and Microintegration IZM, Berlin

Advanced Packaging Goes to Market

Robert Patti_Abstract

Founder – FaBrick AI, President – Nhanced Semiconductors Inc.


Advanced Interconnects for Chiplets

Jonathan Abdilla_Abstract

Product Manager Hybrid Bonding, Besi Netherlands B.V.


Performance Enablement through VIPack FOPOP for Mobile and Networking

Mark Gerber_Abstract

Sr. Director Engineering and Technical Marketing ASE


3D Integration for Quantum Computing

Ryoichi Ishihara_Abstract

Scientist, QuTech, Delft, Nethlands


Micro-Transfer Printing – An Advanced Assembly Technology for Heterogeneous Integration

Alin Fecioru_Abstract

Senior Program Manager, X-Celeprint Ltd