Closing Remarks
3DIC 2021 Conference Wrap-Up
Our physical/virtual hybrid conference drew 141 registered attendees. Thanks to everyone who made this a successful conference! All papers can be found on IEEE Xplorer. A select set of presentations can be found on this Youtube playlist:
https://www.youtube.com/playlist?list=PLfGJEQLQIDBMSGHA1wN9LNaJVxf7CR041
est Paper Awards
Congratulations to:
K. Kiyoyama, Y. Horio, T. Fukushima, H. Hashimoto, T. Orima and M. Koyanagi, “Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing,” 2021 IEEE International 3D Systems Integration Conference (3DIC), Raleigh, NC, USA, 2021, pp. 1-4.
doi: 10.1109/3DIC52383.2021.9687608
C. Dubarry et al., “3D interconnection using copper direct hybrid bonding for GaN on silicon wafer,” 2021 IEEE International 3D Systems Integration Conference (3DIC), Raleigh, NC, USA, 2021, pp. 1-4.
doi: 10.1109/3DIC52383.2021.9687599
A. Mastroianni et al., “Proposed Standardization of Heterogenous Integrated Chiplet Models,” 2021 IEEE International 3D Systems Integration Conference (3DIC), Raleigh, NC, USA, 2021, pp. 1-8.
doi: 10.1109/3DIC52383.2021.9687611