ORGANIZATION

ORGANIZING COMMITTEE

Organizing Committee Chair

• Tetsu Tanaka – Tohoku University

Organiging Committee Co-Chair

• Paul Franzon – North Carolina State University

ASIA

• Tetsu Tanaka – Tohoku University
• Kangwook Lee – SK-hynix
• Takafumi Fukushima – Tohoku University
• Kuan-Neng Chen – National Yang Ming Chiao Tung University

USA

• Paul Franzon – North Carolina State University
• Bob Patti – Nhanced Semiconductor
• Muhannad S Bakir – Georgia Institute of Technology

EUROPE

• Peter Ramm – Fraunhofer EMFT
• Pascal Vivet – CEA-Leti
• Eric Beyne – imec
• V. S. Nagaraja – Tyndall National Institute
• Marco del Sarto – STMicroelectronics

TECHNICAL PROGRAM COMMITTEE

Technical Program Committee Chair

• Takafumi Fukushima – Tohoku University

ASIA

• Masahiro Aoyagi, Kumamoto University
• Kwang-Seong Choi, ETRI
• Takafumi Fukushima, Tohoku University
• Fumihiro Inoue, Yokohama National University
• Katsuya Kikuchi, AIST
• Gu-Sung Kim, Kangnam University
• Sarah Eunkyung Kim, Seoul National University of Science and Technology
• Hisashi Kino, Kyusyu University
• Wei-Chung Lo, ITRI
• Makoto Motoyoshi, Tohoku Microtech (T-Micro)
• Makoto Nagata, Kobe University
• Takayuki Ohba, Tokyo Institute of Technology
• Akitsu Shigetou, NIMS
• Shoso Shinguhara, Kansai University
• Chuan Seng Tan, Nanyang Technological University

USA

• Jeff Burns, IBM
• Rhett Davis, North Carolina State University
• T. Robert Harris, Georgia Tech Research Institute
• Soha Hassoun, Tufts University
• Craig Keast, Massachusetts Institute of Technology
• Eren Kursun, IBM
• Sung Kyu Lim, Georgia Institute of Technology
• James Lu, Rensselaer Polytechnic Institute
• Pat Morrow, Intel Corporation
• Zvi Or-Bach, Monolithic 3D
• Shivam Priyadarshi, Microsoft
• Katsuyuki Sakuma, IBM
• Sachin Sapatnekar, University of Minnesota
• Nagesh Vodralli, ALLVIA, Inc
• Yuan Xie, University of California, Santa Barbara
• Cindy Yi, Virginia Polytechnic Institute and State University

EUROPE

• Severine Cheramy, CEA-Leti
• Patrick Leduc, CEA-Leti
• Cian O’Murchu, Tyndall Institute
• Klaus Pressel, Infineon
• Fred Roozeboom, Eindhoven University of Technology
• Michael Schiffer, Fraunhofer IZM
• Cristina Torregiani, Infineon
• Geert Van Der Plas, imec
• Dimitris Velenis, imec

CONFERENCE PUBLICATION CHAIR

• Hisashi Kino – Kyusyu University

SPONSORING INSTITUTIONS

• Fraunhofer EMFT – Munich, Germany
• imec – Leuven, Belgium
• Tohoku University – Sendai, Japan
• North Carolina State University – Raleigh, North Carolina, USA

SponsorS

• IEEE EPS