Call for papers - EXTENDED!
Now accepting abstracts for papers – EXTENDED!
Abstracts for papers are solicited on all 3D IC topics including, but not limited to, the following:
Technology: Materials, equipment, wafer handling, diverse substrates, Through Silicon Vias (TSV), alignment, bonding (thermo-compression, electrostatic, hybrid, temporary adhesive), de-bonding, wafer cleaning, thinning, dicing, chiplets, interposers (active, passive), 3D integration (monolithic, heterogeneous), capacitive coupling, inductive coupling, multilevel epitaxial growth, etc.
Design and CAD: Synthesis, design flows, signal design, power integrity, thermal considerations, mechanical stress, reliability, test, techniques, analysis, etc. Applications to be considered may include imaging, memory, processors, communications, networking, wireless, biomedical, sensors, SOC, MEMS, DSP, FPGA, RF, microwave, millimeter wave, analog circuits, biomedical circuits, photonics, optoelectronics, etc.
- Abstracts should be about 500 words in length
- Some figures and tables can be included
- The deadline for submissions is August 7
- Notifications will occur by August 31
- Full papers in IEEE format will be required by September 30
Submit your abstract here:
Abstract Submission Site
Also soliciting proposals for tutorials, panels, and workshop presentations
Tutorials can be presented virtually or on site. If you have an idea for a tutorial please contact us.
A half-day workshop on “Future Directions for 3DIC” will be held on site. This will be for physical attendees only.
If you are interested in presenting at the workshop please contact us.
Panel discussions may be conducted as on-site, virtual, or hybrid. If you have an idea for a panel please contact us.
This call for papers is also available as a pdf document: