Call for Abstracts

Abstracts are to be one page of text with one page of figures and drawings.

Authors of accepted manuscripts will have the option of submitting a full paper (4 pages) for inclusion in the Conference Proceedings. The proceedings of IEEE 3DIC 2018 will be available and indexed on the IEEE Xplore system.

Important Dates:

Call for abstracts Opened

Please click here to submit an abstract

Abstract submission deadline
29th June 2018

Notification of Acceptance
17th of August 2018

Deadline for accepted authors to register to confirm attendance
15th September 2018

Deadline for accepted authors to submit final paper
28th September 2018

Publishing of Abstracts:

Accepted full papers will be published post-conference on IEEE Xplore system.

3D IC will cover all 3D IC topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and attendees to submit and interact with 3D researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following:

3D IC Technology. Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, 3D IC process, monolithic 3D integration, heterogeneous 3D integration, Capacitive coupling, Inductive coupling, multilevel epitaxial growth, etc.

3D IC Circuits Technology. 3D SOC, 3D Memory, 3D Processor, 3D DSP, 3D FPGA, 3D RF and microwave/millimeter wave, 3D analog circuits, 3D Biomedical circuits etc.

3D Applications. Imaging, memory, processors, communications, networking, wireless, biomedical etc.

3D Design Methodology. 3D CAD, 3D synthesis, 3D design flows, Signal and power integrity analysis and design in 3D, 3D thermal design and analysis, test and design for test; 3D mechanical stress and reliability design and analysis, etc.