Call for Papers

Deadline for papers and proposals is June 30, 2016. Abstracts are to be 500 words in length, and some figures and tables can be included. Notifications will occur by August 15, 2016 and full papers in IEEE format will be required by October 7, 2016.

Papers may be submitted here

Instructions for Final Paper Submission IEEE 3DIC 2016 – REVISED DEADLINE – October 7

  1. Papers must be in IEEE double column format. We are expecting four pages but five is acceptable.  See here for more information.


  1. You must pass your paper through PDF Express first to make sure it is Xplorer compliant. The conference ID is 38342X .  You will need your email address and will need to create a passworkd
  1. You will get a sanitized paper back from PDF Xpress. Upload this and a completed copyright form to the conference paper website. Submit at the edas site (on the right “final manuscript”). See the Copyright form as well


  1. At least one author should be registered for the conference at the full rate (not student) in order for the final paper to be accepted.

3D IC will cover all 3D IC topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and attendees to submit and interact with 3D researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following:

3D IC Technology. Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, 3D IC process, monolithic 3D integration, heterogeneous 3D integration, Capacitive coupling, Inductive coupling, multilevel epitaxial growth, etc.

3D IC Circuits Technology. 3D SOC, 3D Memory, 3D Processor, 3D DSP, 3D FPGA, 3D RF and microwave/millimeter wave, 3D analog circuits, 3D Biomedical circuits etc.

3D Applications. Imaging, memory, processors, communications, networking, wireless, biomedical etc.

3D Design Methodology. 3D CAD, 3D synthesis, 3D design flows, Signal and power integrity analysis and design in 3D, 3D thermal design and analysis, test and design for test; 3D mechanical stress and reliability design and analysis, etc.