3DIC 2019 Call for Papers
The IEEE International 3D Systems Integration Conference (3DIC) will be held at the Hotel Metropolitan Sendai and Miyagino Ward Cultural Center in Sendai, Japan on October 8th-10th, 2019. The deadline for abstract submission is May 31, 2019.
Abstracts are to be one page of text (500 words) and one-page figures.
Authors of accepted manuscripts will have the option of submitting a full paper (4 pages) for inclusion in the Conference Proceedings.
Abstract submission deadline
31st May 2019
Notification of Acceptance
17th June 2019
Deadline for accepted authors to submit the final paper
20th August 2019
Publishing of Abstracts:
Accepted papers will be submitted for inclusion into IEEE Xplore
3DIC 2019 will cover all 3D integration topics, including 3D/2.5D process technology, materials, equipment, circuits technology, design methodology, and applications. The conference invites authors and attendees to submit and interact with researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following:
3D/2.5D Integration Technology: Through Si Vias (TSV), Wafer thinning, Wafer alignment, Wafer bonding, Wafer dicing, Interposer (Si/Glass), FOWLP, Monolithic 3D integration, Heterogeneous 3D/2.5D integration
3D/2.5D IC Circuits Technology: SOC, Memory, Processor, DSP, FPGA, RF and µ-wave/mm-wave, Analog circuits, Biomedical circuits
3D/2.5D Applications: Artificial Intelligence, Machine Learning, Deep Learning, Imaging, IoT, Memory, Processors, Communications, Network-ing, Wireless, Biomedical
3D/2.5D Design and Test Methodology: CAD, Synthesis, Design flows, Signal and power integrity analysis and design in 3D/2.5D, Thermal de-sign and analysis, Test and design for test, Mechanical stress and relia-bility design and analysis