The IEEE International 3D Systems Integration Conference (3DIC) will be held at the Hotel Metropolitan Sendai and Miyagino Ward Cultural Center in Sendai, Japan on October 8th-10th, 2019. The deadline for abstract submission is
June 24 July 31, 2019 (PST).
Click here for your abstract submission. (Closed)
Abstract submission deadline
June 24, 2019
July 31, 2019 (PST)
Notification of Acceptance
August 19, 2019
*The notification to all authors who submitted the abstract should have received the review result by email. Please contact if the authors do not received it.
Deadline for accepted authors to submit the final paper
September 20, 2019
Publishing of final paper
Accepted papers will be submitted for inclusion into IEEE Xplore.
3DIC 2019 will cover all 3D integration topics, including 3D/2.5D process technology, materials, equipment, circuits technology, design methodology, and applications. The conference invites authors and attendees to submit and interact with researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following: