3DIC 2019 Call for Papers

The IEEE International 3D Systems Integration Conference (3DIC) will be held at the Hotel Metropolitan Sendai and Miyagino Ward Cultural Center in Sendai, Japan on October 8th-10th, 2019. The deadline for abstract submission is June 24 July 8, 2019.

Abstracts are to be one page of text (500 words) and one-page figures.

Notifications will occur by July 26, 2019 and full papers in IEEE format will be required by August 26, 2019.

Click here for your abstract submission.

Important Dates

Abstract submission deadline
June 24, 2019
July 8, 2019

Notificaiton of Acceptance
July 26, 2019

Deadline for accepted authors to submit the final paper
August 26, 2019

Publishing of final paper
Accepted papers will be submitted for inclusion into IEEE Xplore.

 

 

3DIC 2019 will cover all 3D integration topics, including 3D/2.5D process technology, materials, equipment, circuits technology, design methodology, and applications. The conference invites authors and attendees to submit and interact with researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following:

 

3D/2.5D Integration Technology: Through Si Vias (TSV), Wafer thinning, Wafer alignment, Wafer bonding, Wafer dicing, Interposer (Si/Glass), Optical Interconnection, FOWLP, Monolithic 3D integration, Heterogeneous 3D/2.5D integration
 
3D/2.5D IC Circuits Technology:  SOC, Memory, Processor, DSP, FPGA, RF and µ-wave/mm-wave, Analog circuits, Biomedical circuits
 
3D/2.5D Applications: Artificial Intelligence, Machine Learning, Deep Learning, Imaging, IoT, Memory, Processors, Communications, Network-ing, Wireless, Biomedical
 
3D/2.5D Design and Test Methodology: CAD, Synthesis, Design flows, Signal and power integrity analysis and design in 3D/2.5D, Thermal de-sign and analysis, Test and design for test, Mechanical stress and relia-bility design and analysis